000			01295cam a2200337 a 4500
001			2145509
003			BD-DhUL
005			20150118110018.0
008			980715s1998 nyua 000 0 eng
010			_a 98065029 _z 98163137
020			_a0079137121 (alk. paper)
040			_aBD-DhUL _cBD-DhUL _dDLC _dBD-DhUL
050	0	0	_aTK454 _b.K47 1998
082			_a621.3192 _bKII
100	1		_aKielkowski, Ron M.
245	1	0	_aInside SPICE / _cRon M. Kielkowski.
250			_a2nd ed.
260			_aNew York : _bMcGraw-Hill, _cc1998.
300			_axv, 200 p. : _bill. ; _c24 cm. +
365			_aUS$ _b11.50
440		0	_aElectronic packaging and interconnection series
504			_aIncludes bibliographical references and index.
630	0	0	_aSPICE (Computer file)
650		0	_aElectric circuits _xComputer simulation.
856	4	2	_3Publisher description _uhttp://www.loc.gov/catdir/description/mh023/98065029.html
856	4	1	_3Table of contents _uhttp://www.loc.gov/catdir/toc/mh022/98065029.html
856	4	2	_3Contributor biographical information _uhttp://www.loc.gov/catdir/enhancements/fy0705/98065029-b.html
906			_a7 _bcbc _corignew _d2 _eopcn _f19 _gy-gencatlg
942			_2ddc _cBK
955			_ajb14 to jf 06-23-98; jf00 6-24-98; jf08 07-02-98 to SL;jf12 07-09-98 to ddc
999			_c32583 _d32583