| 000 | 01099cam a2200277 4500 | ||
|---|---|---|---|
| 001 | 4057895 | ||
| 003 | BD-DhUL | ||
| 005 | 20150115181045.0 | ||
| 008 | 720830s1962 coua b 100 0 eng | ||
| 010 | _a 62002203 | ||
| 040 |
_aDLC _cDLC _dDLC _dBD-DhUL |
||
| 050 | 0 | 0 |
_aTK7870 _b.I574 1960 |
| 082 |
_a621.381046 _bWAA |
||
| 111 | 2 |
_aInternational Electronic Circuit Packaging Symposium _n(1st : _d1960 : _cBoulder, Colo.) |
|
| 245 | 1 | 0 |
_aAdvances in electronic circuit packaging : _bproceedings of the second international electronic circuit packaging symposium [vol. II.] / _cEdited by Gerald A. Walker. |
| 260 |
_aNew York : _b Plenum ; _cc1962. |
||
| 300 |
_axiv, 328 p. : _bills. ; _c26 cm. |
||
| 500 | _a"Sponsored by the University of Colorado and EDN [Electrical design news)." | ||
| 504 | _aIncludes bibliographical references. | ||
| 650 | 0 |
_aElectronic packaging _xCongresses. |
|
| 700 | 1 |
_aWalker, Gerald A. _eed. |
|
| 710 | 2 | _aUniversity of Colorado (Boulder campus) | |
| 730 | _aElectrical design news. | ||
| 906 |
_a7 _bcbc _corignew _d4 _eocip _f19 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
||
| 999 |
_c31897 _d31897 |
||