| 000 | 00851pam a2200265 a 4500 | ||
|---|---|---|---|
| 001 | 3887764 | ||
| 003 | BD-DhUL | ||
| 005 | 20150105112330.0 | ||
| 008 | 900926s1991 nyua b 001 0 eng | ||
| 010 | _a 90015510 | ||
| 020 | _a0306434717 | ||
| 040 |
_aDLC _cDLC _dDLC _dBD-DhUL |
||
| 050 | 0 | 0 |
_aTP968 _b.A27 1991 |
| 082 | 0 | 0 |
_a668.3 _bADH |
| 245 | 0 | 0 |
_aAdhesive bonding / _cedited by Lieng-Huang Lee. |
| 260 |
_aNew York : _bPlenum Press, _cc1991. |
||
| 300 |
_axvii, 476 p. : _bill. ; _c26 cm. |
||
| 365 |
_aUS$ _b132 |
||
| 504 | _aIncludes bibliographical references and indexes. | ||
| 650 | 0 | _aAdhesives. | |
| 700 | 1 |
_aLee, Lieng-Huang, _d1924- |
|
| 906 |
_a7 _bcbc _corignew _d1 _eocip _f19 _gy-gencatlg |
||
| 942 |
_2ddc _cBK |
||
| 955 | _apc14 to be00 09-26-90; be27 to SCD 09-27-90; fg05 09-27-90; fl22 10-02-90; CIP ver. bd01 to SL 03-15-91 | ||
| 999 |
_c27309 _d27309 |
||