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  <titleInfo>
    <title>Advances in electronic circuit packaging</title>
    <subTitle>proceedings; vol. 2</subTitle>
  </titleInfo>
  <titleInfo type="uniform">
    <title>Electrical design news</title>
  </titleInfo>
  <name type="conference">
    <namePart>International Electronic Circuit Packaging Symposium 1961 : Boulder, Colo.)</namePart>
    <role>
      <roleTerm authority="marcrelator" type="text">creator</roleTerm>
    </role>
  </name>
  <name type="personal">
    <namePart>Walker, Gerald A.</namePart>
    <role>
      <roleTerm type="text">editor.</roleTerm>
    </role>
  </name>
  <name type="corporate">
    <namePart>University of Colorado (Boulder campus)</namePart>
  </name>
  <typeOfResource>text</typeOfResource>
  <genre authority="marc">bibliography</genre>
  <genre authority="marc">conference publication</genre>
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    <place>
      <placeTerm type="text">Englewood, Colo</placeTerm>
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    <publisher>Rogers Pub. Co.</publisher>
    <dateIssued>C1962</dateIssued>
    <dateIssued encoding="marc">1962</dateIssued>
    <issuance>monographic</issuance>
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  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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  <physicalDescription>
    <form authority="marcform">print</form>
    <extent>xiv, 328 p. : ills. ; 26 cm.</extent>
  </physicalDescription>
  <note type="statement of responsibility">Edited by Gerald A. Walker.</note>
  <note>"Sponsored by the University of Colorado and EDN (Electrical design news)."</note>
  <note>Includes bibliographical references.</note>
  <subject authority="lcsh">
    <topic>Electronic packaging</topic>
    <topic>Congresses</topic>
  </subject>
  <classification authority="lcc">TK7870 .I574 1961</classification>
  <classification authority="ddc">621.381046 WAA</classification>
  <identifier type="lccn">72187721</identifier>
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