04803cam a2200745Ia 4500 ocn779616373 OCoLC 20171115085647.0 m o d cr cn||||||||| 120309s2012 gw a obf 001 0 eng d 9783527644247 (electronic bk.) 3527644245 (electronic bk.) 3527644245 9783527644223 3527644229 9783527644230 3527644237 9783527644254 3527644253 3527326464 9783527326464 AU@ 000049013971 AU@ 000053017069 DEBBG BV041829410 DEBSZ 372696236 DKDLA 820120-katalog:000600708 NZ1 14696616 NZ1 15340966 (OCoLC)779616373 (OCoLC)785777901 (OCoLC)794707297 (OCoLC)961632813 (OCoLC)962650779 10.1002/9783527644223 Wiley InterScience http://www3.interscience.wiley.com DG1 eng pn DG1 E7B YDXCP GZM OCLCO DEBSZ OCLCQ N$T OCLCF OCLCQ CDX COO OCL OCLCQ AZK DG1 MAIN QC611.6.S9 H36 2012 TEC 008090 bisacsh TEC 008100 bisacsh 621.38152 22 Handbook of wafer bonding / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. [electronic resource] Weinheim : Wiley-VCH, ©2012. 1 online resource (xxxi, 395 pages) : illustrations (some color) text txt rdacontent computer c rdamedia online resource cr rdacarrier data file rda Bibliography Handbook Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. Includes bibliographical references and index. Front Matter -- Technologies. Glass Frit Wafer Bonding / Roy Knechtel -- Wafer Bonding Using Spin-On Glass as Bonding Material / Viorel Dragoi -- Polymer Adhesive Wafer Bonding / Frank Niklaus, Jian-Qiang Lu -- Anodic Bonding / Adriana Cozma Lapadatu, Kari Schj̜lberg-Henriksen -- Direct Wafer Bonding / Manfred Reiche, Ulrich G̲sele -- Plasma-Activated Bonding / Maik Wiemer, Dirk Wuensch, Joerg Braeuer, Thomas Gessner -- Au/Sn Solder / Hermann Oppermann, Matthias Hutter -- Eutectic Au?In Bonding / Mitsumasa Koyanagi, Makoto Motoyoshi -- Thermocompression Cu?Cu Bonding of Blanket and Patterned Wafers / Kuan-Neng Chen, Chuan Seng Tan -- Wafer-Level Solid₆Liquid Interdiffusion Bonding / Nils Hoivik, Knut Aasmundtveit -- Hybrid Metal/Polymer Wafer Bonding Platform / Jian-Qiang Lu, J Jay McMahon, Ronald J Gutmann -- Cu/SiO Hybrid Bonding / Ľa Di Cioccio -- Metal/Silicon Oxide Hybrid Bonding / Paul Enquist -- Applications. Microelectromechanical Systems / Maaike M V Taklo -- Three-Dimensional Integration / Philip Garrou, James Jian-Qiang Lu, Peter Ramm -- Temporary Bonding for Enabling Three-Dimensional Integration and Packaging / Rama Puligadda -- Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems / Armin Klumpp, Peter Ramm -- Thin Wafer Support System for above 250ʻC Processing and Cold De-Bonding / Werner Pamler, Franz Richter -- Temporary Bonding: Electrostatic / Christof Landesberger, Armin Klumpp, Karlheinz Bock -- Index. Print version record. Semiconductor wafers Handbooks, manuals, etc. Semiconductors Bonding Handbooks, manuals, etc. TECHNOLOGY & ENGINEERING Electronics Semiconductors. bisacsh TECHNOLOGY & ENGINEERING Electronics Solid State. bisacsh Semiconductor wafers. fast (OCoLC)fst01112189 Semiconductors Bonding. fast (OCoLC)fst01112201 Electronic books. Handbooks and manuals. fast (OCoLC)fst01423877 Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V. Print version: Handbook of wafer bonding. Weinheim : Wiley-VCH, ©2012 9783527326464 (OCoLC)781684626 http://onlinelibrary.wiley.com/book/10.1002/9783527644223 Wiley Online Library ddc BK 205691 205691