Handbook of wafer bonding / edited by Peter Ramm, James Jian-Qiang Lu, and Maaike M.V. Taklo. [electronic resource] Ramm, Peter. Lu, James Jian-Qiang. Taklo, Maaike M. V. Semiconductor wafers Handbooks, manuals, etc. Semiconductors Bonding Handbooks, manuals, etc. QC611.6.S9 H36 2012 621.38152 22 Written by an author and editor team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. In the first part, researchers from companies and institutions around the world discuss the most reliable and reproducible technologies for the production of bonded wafers. The second part is devoted to current and emerging applications, including microresonators, biosensors and precise measuring devices. Includes bibliographical references and index. Print version record. Weinheim : Wiley-VCH, ©2012. ©2012. 2012 Text 1 online resource (xxxi, 395 pages) : http://onlinelibrary.wiley.com/book/10.1002/9783527644223 eng Handbook of wafer bonding. Handbook of wafer bonding.