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  <titleInfo>
    <title>Advanced interconnects for ULSI technology</title>
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  <name type="personal">
    <namePart>Baklanov, Mikhail.</namePart>
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  <name type="personal">
    <namePart>Ho, P. S.</namePart>
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  <name type="personal">
    <namePart>Zschech, Ehrenfried.</namePart>
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    <place>
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    <publisher>Wiley</publisher>
    <dateIssued>2012</dateIssued>
    <issuance>monographic</issuance>
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  <abstract>"This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"--</abstract>
  <tableOfContents>Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index.</tableOfContents>
  <note type="statement of responsibility">[edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech.</note>
  <note>Includes bibliographical references and index.</note>
  <subject authority="lcsh">
    <topic>Interconnects (Integrated circuit technology)</topic>
  </subject>
  <subject authority="lcsh">
    <topic>Integrated circuits</topic>
    <topic>Ultra large scale integration</topic>
  </subject>
  <subject>
    <topic>Integrated circuits</topic>
    <topic>Ultra large scale integration</topic>
  </subject>
  <subject>
    <topic>Interconnects (Integrated circuit technology)</topic>
  </subject>
  <subject authority="bisacsh">
    <topic>TECHNOLOGY &amp; ENGINEERING</topic>
    <topic>Electronics</topic>
    <topic>Circuits</topic>
    <topic>VLSI &amp; ULSI</topic>
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    <topic>COMPUTERS</topic>
    <topic>Logic Design</topic>
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  <subject authority="bisacsh">
    <topic>TECHNOLOGY &amp; ENGINEERING</topic>
    <topic>Electronics</topic>
    <topic>Circuits</topic>
    <topic>Logic</topic>
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  <subject authority="fast">
    <topic>Integrated circuits</topic>
    <topic>Ultra large scale integration</topic>
  </subject>
  <subject authority="fast">
    <topic>Interconnects (Integrated circuit technology)</topic>
  </subject>
  <classification authority="lcc">TK7874.53 .A39 2012eb</classification>
  <classification authority="ddc" edition="23">621.39/5</classification>
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      <title>Advanced interconnects for ULSI technology</title>
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  <identifier type="isbn">9781119963240</identifier>
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  <identifier type="stock number">10.1002/9781119963677 Wiley InterScience</identifier>
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