04665cam a2200721Ka 4500 ocn778448543 OCoLC 20171115100346.0 m o d cr cnu---unuuu 120228s2012 nju ob 001 0 eng d 9781119963240 (electronic bk.) 1119963249 (electronic bk.) 9781119963677 (electronic bk.) 1119963672 (electronic bk.) 1280590807 9781280590801 9780470662540 0470662549 9786613620637 AU@ 000050204433 DEBBG BV041829362 DEBSZ 431101108 DKDLA 820120-katalog:000600718 GBVCP 790036215 NZ1 15900549 (OCoLC)778448543 (OCoLC)779617142 (OCoLC)817082211 (OCoLC)819896613 10.1002/9781119963677 Wiley InterScience http://www3.interscience.wiley.com N$T eng pn N$T EBLCP DG1 YDXCP CDX COO OCLCQ IDEBK OCLCQ AU@ OCLCO OCLCF OCLCQ RECBK DEBSZ OCLCQ S3O OCLCQ DG1 MAIN TK7874.53 .A39 2012eb COM 036000 bisacsh TEC 008030 bisacsh TEC 008050 bisacsh 621.39/5 23 Advanced interconnects for ULSI technology / [edited by] Mikhail Baklanov, Paul S. Ho, Ehrenfried Zschech. [electronic resource] Hoboken, NJ : Wiley, 2012. 1 online resource text txt rdacontent computer c rdamedia online resource cr rdacarrier Includes bibliographical references and index. Front Matter -- Colour Plates -- Section I: Low-. Low- Materials: Recent Advances / Geraud Dubois, Willi Volksen -- Ultra-Low- by CVD: Deposition and Curing / Vincent Jousseaume, Aziz Zenasni, Olivier Gourhant, Laurent Favennec, Mikhail R Baklanov -- Plasma Processing of Low- Dielectrics / Hualiang Shi, Denis Shamiryan, Jean-Fraṅois de Marneffe, Huai Huang, Paul S Ho, Mikhail R Baklanov -- Wet Clean Applications in Porous Low- Patterning Processes / Quoc Toan Le, Guy Vereecke, Herbert Struyf, Els Kesters, Mikhail R Baklanov -- Section II: Conductive Layers and Barriers. Copper Electroplating for On-Chip Metallization / Valery M Dubin -- Diffusion Barriers / Michael Hecker, Rene Hubner -- Section III: Integration and Reliability. Process Integration of Interconnects / Sridhar Balakrishnan, Ruth Brain, Larry Zhao -- Chemical Mechanical Planarization for Cu₆Low- Integration / Gautam Banerjee -- Scaling and Microstructure Effects on Electromigration Reliability for Cu Interconnects / Chao-Kun Hu, Rene Hubner, Lijuan Zhang, Meike Hauschildt, Paul S Ho -- Mechanical Reliability of Low- Dielectrics / Kris Vanstreels, Han Li, Joost J Vlassak -- Electrical Breakdown in Advanced Interconnect Dielectrics / Ennis T Ogawa, Oliver Aubel -- Section IV: New Approaches. 3D Interconnect Technology / John U Knickerbocker, Lay Wai Kong, Sven Niese, Alain Diebold, Ehrenfried Zschech -- Carbon Nanotubes for Interconnects / Mizuhisa Nihei, Motonobu Sato, Akio Kawabata, Shintaro Sato, Yuji Awano -- Optical Interconnects / Wim Bogaerts -- Wireless Interchip Interconnects / Takamaro Kikkawa -- Index. "This book presents an in-depth overview of present status, novel developments and new materials and approaches for advanced interconnect technology"-- Provided by publisher. Print version record. Interconnects (Integrated circuit technology) Integrated circuits Ultra large scale integration. Integrated circuits Ultra large scale integration. Interconnects (Integrated circuit technology) TECHNOLOGY & ENGINEERING Electronics Circuits VLSI & ULSI. bisacsh COMPUTERS Logic Design. bisacsh TECHNOLOGY & ENGINEERING Electronics Circuits Logic. bisacsh Integrated circuits Ultra large scale integration. fast (OCoLC)fst00975596 Interconnects (Integrated circuit technology) fast (OCoLC)fst00976051 Electronic books. Baklanov, Mikhail. Ho, P. S. Zschech, Ehrenfried. EBL Print version: Advanced interconnects for ULSI technology. Hoboken, NJ : Wiley, 2012 9780470662540 (DLC) 2011038787 (OCoLC)757478544 http://onlinelibrary.wiley.com/book/10.1002/9781119963677 Wiley Online Library ddc BK 205648 205648